HB05 THERMOSONIC WIRE BONDER is used for wire bonding in Wedge/Wedge, Ball/Wedge or Bump bonding mode.
Welding Machine - HB05 Thermosonic Wire Bonder
Technical specifications:
- Bonding method: Wedge /Wedge, Ball /Wedge or Bump bonding mode
- Gold/Aluminium wire diameter: 17-50 µm
- Gold ribbon: up to 25 x 200 µm
- Ultrasonic system: PLL Control 62 kHz transducer
- Ultrasonic power: 0 -1 watt Low / 0-2 watt High output
- Bond time: 20-5000 msec.
- Bond force: 15-150 grams
- Ball Bonding Tool: 1.58 Dia. x 19 mm length
- Wedge Bonding Tool: 1.58 Dia. x 19 mm length
- Wire Spool: 50.8 mm
- Wire termination: Bond Head tear
- Wire feed angle: 90° for Wire and Ribbon
- Accessories: Heater Stage /Temperature controller up to 250°C +/- 1°C
- Operating temperature: 18°C - 32°C.
Services: Welding metallic wires (Au or Al) for making electrical contacts.